DEK265操作手册..ppt

Foxconn Technology GroupSMT Technology CenterSMT 技術中心一一.印刷工站的基本認知印刷工站的基本認知 二二.印刷机的基本認識印刷机的基本認識 三三.印刷機的性能參數印刷機的性能參數 四四.印刷機的操作印刷機的操作 五五.安全知識安全知識 六六.錯誤信息識別錯誤信息識別 七七.印刷机的日常點檢印刷机的日常點檢/保養保養 八八.結束語結束語 BoardHandlingMaximum size(inches) 20X20Minimum size(inches)1.75X1.75Maximum thickness(inches)0.02 to 0.25Minimum thickness(inches)N/AMaximum warpage(inches)0.3underside component clearance(inches)0.12 to 1.57Board held by Eege clampBoard supportMagnetic pins,tooling pins,Conveyor StandardBoard movementR to L,L to RPrint HeadPrint area (inches)20 x19.5Maximum print stroke(inches)2.2 to 22.3Mdthod of registrationVisionOptical alignment?YesAlignment accuracy(microns)+/-25Alignment repeatability(microns)25Print ModesPrint/print,Print/flood,flood/print,on contact 1 or 2 depositsPrint speed(inches/second)0.08 to 5.9Print pressure(pounds)0 to 44Snap off(print gap) (inches)0 to 0.24Is snap-off programmable?yes Cycle time(seconds)Single lane:12.5StencilFrame size(inches) 29x29PCB stencil seperation speed (inches/second)0.04 to 0.79Stencil cleaningDry,wet ,vacuumProgrammable?YesStencil WiperOptionalSqueegeeSqueegees Metal,polyurethaneSqueegee pressure (pounds)0 to 44Where measured?Load cell in printHorizontal or central pivot?HorizontalVision systemType On the move,look up,look downField of vision (inches)0.24x0.32Align calibrationFully automaticPost-print inspection available?2-DProgramNumber of programs stored1000错误信息提示错误信息提示原原 因因1Board On Rails, Remove and Continue这说明机器以下几种情况下感应到有PCB板在轨道上面：1：开机初始化系统时2：下载新产品程序时3：在诊断程序中进入轨道系统时2Front Squeegee Pressure Error显示此信息之后会有一新的窗口显示设定压力值与实际压力值。3Pneumatic Power Down表示气压太低或没有接入气体4Rail Lifted Error,Check Tooling可能是在轨道的正下方错误的放置了顶PIN。5System Power Down可能是因按下E-STOP键或前盖后盖打开而致使24V马达电源断开。6System Suspended While Covers Open这表明机器系统化时前盖或后盖处于开启状态。7Upline Board Transfer Error这表明上线传输有错误（印刷机在设定时间内没有收到PCB板）。8X Actuator Limit Exceeded这表明在校准时，调整马达超过其X轴向移动极限。9Y Actuator Limit Exceeded这表明在校准时，调整马达超过其Y轴向移动极限。