IPC-A-610国际标准中英文对照(doc 17).docx
IPC-A-610国际标准中英文对照4. 6.2HeatSink-Contact散热片一一接触片arget-C1.ass1,2.3目标等级1.2,3,Componentandheatsinkareinfu1.1.contactwiththemountingsurface.组件和散热片与安装外表完全接触Hardwaremeetsspecifiedattachmentrequirements.部件满足规定的接触要求。Figure图4-641. Heatsink散热片Acceptab1.e-C1.ass1,2,3可接受的一一等级1,2,3,Componentnotf1.ush.组件不平齐Minimum75%contactwithmountingsurface.至少有754与安装外表接触,Hardwaremeetsmountingtorquerequirementsifspecified.如果有规定,部件满足安装的转距要求Figure图4-651.Gap2.Heatsink间隙散热片Defect-C1.ass1,2,3缺点等级1,2,3,Componentisnotincontactwithmountingsurface.组件没有接触到安装外表,Hardwareis1.ooseandcanbemoved.部件松弛可以移动。Figure图4-661.Heatsink2,Gap散热片间隙5. 1Orientation方向6. 1.1Orientation-Horizonta1.方向水平Target-C1.ass1.2,3目标一一等级1.2,3,Componentsarecenteredbetweentheir1.ands.组件位于焊盘中央,Componentmarkingsarediscernib1.e.组件标识清晰可见 Nonpo1.arizedcomponentsareorientedsothatmarkingsa1.1.readthesameway(1.eft-to-rightortop-to-bottom).FigUre图5T无极性组件的方向应使箕标识都能按同样方式进行辨识(从左到右或从上到下)Acceptab1.e-C1.ass1.2,3可接受的一一等级1.2,3 Po1.arizedandmu1.ti1.eadcomponentsareorientedcorrect1.y.有极性和多引脚的组件应按正确方向安装。,Whenhandformedandhand-inserted,po1.arizationsymbo1.sarediscernib1.e.当手工成型及手插件叶，极性符号可以辨识。 AponentsareasspecifiedandterminatetoFigure图5-2correct1.ands.所有组件都符合规定并连接到正确的焊盘上。,Nonpo1.arizedcomponentsdonotneedtobeorientedsothatmarkingsa1.1readthesameway(1.eft-torightorIoPIo-bottom).无极性的组件不需要按同样的方向，只要标识可按相同方向辨识即可(从左到右或从上到下).5. 1.1Orientation-Horizonta1.(cont.)方向一一水平(较)Defect-C1.ass1.2,3缺点等级1.2.3 Componentisnotasspecified(Wrongpart).殂件不符合规定(组件错误),Componentnotmountedincorrectho1.es.组件没有安装在正确的孔中。 Po1.arizedcoInponen1.mountedbackwards.有极性组件安装方向相反。 Mu1.ti1.eadedcomponentnotorientedcorrect1.y.Figure图5-3多引脚组件的安装方向不正确。5. 1.2Orientation-Vertica1.方向垂直Target-C1.ass1.2,3目标一一等级1.2,3,Nonpo1.arizedcomponentmarkingsreadfromthetopdown.无极性组件的标识可以从上至下辨识,Po1.arizedmarkingsare1.ocatedontop.极性标识位于顶器.Figure图5-4Acceptab1.e-C1.ass1.2.3可接受的一一等级1,2,3,Po1.arizedpartismountedWitha1.ongground1.ead.极性沮件安装时有长的接地引脚 Po1.arizedmarkinghidden.极性标识被隐藏起来 Nonpo1.arizedcomponentmarkingsreadfrombottomtotop.无极性组件标识可以从底至上辨识。Figure图5-5Defect-C1.ass1.2,3缺点一一等级1,2,3 Po1.arizedcomponentismountedbackwards.极性组件安装反向。Figure图5-65.2Mounting安装5.2.1Mounting-HorizontaI-Axia1.1.eaded-SUPPOrtedHo1.es安装一一水平一一轴向引脚一一有支撑孔Target-C1.ass1,2,3目标一一等级1.2,3Theentirebody1.engthofthecomponentisincontactwiththeboardsurface.整个阻件本体长度与线路板外表完全接触,Componentsrequiredtobemountedofftheboardare,at1.east1.5mmC.059infromtheboardsurface；e.g.highheatdissipating.密要离开鼓路板外表安装的组件至少要樨开线路收Figure图5-7平面1.5Mn(0.059in),如高散热器件一Figure图5-85.2.1Mounting-Horizonta1-Axia11.eaded-SupportedHo1.es(cont.)安装一一水平一一轴对称引脚有支撑孔Acceptab1.e-C1.ass1.2可接受的一一等级1,2,3,Themaximumspacebetweenthecomponentandtheboardsurfacedoesnotvio1.atetherequirementsfor1.eadprotrusion(see5.2.7)orcomponentheight（三）.FigUre图5-9(（三）isauser-determineddimension.)组件与线路板平面之同的最大间距不应连反引脚突出(见5.2.7)或组件高度（三）的要求。(高度（三）是由使用者决定的尺寸)ProcessIndicator-C1.ass3程序指示等级3, Thefarthestdistancebetweenthecomponentbodyandtheboard(D)is1.argerthan0.7m0.028in.组件本体与境路板之间的最大的距离(D)超过0.711w<0.028in)。Defect-C1.ass1,2.3缺点等级1,2,3, Componentsrequiredtobemountedabovetheboardsurfaceare1.essthan1.5n1.O.059in要求离开线路板外表安装的组件与线路板的距海小于1.5m(0.059in).5.2.2Mounting-Horizonta1-Axia11.eaded-UnsupportedHo1.es安装一一水平一一轴向引脚一一无支撑的孔Target-C1.ass1,2,3目标一一等级1.2.3Theentirebody1.engthofthecomponentisincontactwiththeboardsurface.整个缎件本体长度与线路板外表完全接触.,Componentsrequiredtobemountedofftheboardareatminimum1.5mra.059infromtheboardFigure图5-10surface：e.g.,highhea1.dissipating.1.NoP1.atinginbarre1.需要离开线路板外表安装的组件至少要离开鼓路板平孔壁上没有电镀面1.5mm(0.059in),如高散热器件Componentsrequiredtobemountedofftheboardareprovidedwith1.eadformsattheboardsurfaceorothermechanica1.supporttoprevent1.iftingofso1.der1.and.需要离开歧路板安装的组件在线路板外表利用引脚形状或箕它机械支撑来防止炸盘的超起。FigUr。图5-11FigUre图5-121.1.eadforms引脚形状Defect-C1.ass1.2,3缺点等级1.2,3,Componentsrequiredtobemountedofftheboardarenotprovidedwith1.eadformsattheboardsurfaceorothermechanica1.supporttoprevent1itingofso1.der1.and.Figure图5-13需要离开面板安装的组件在线路板外表未利用引脚的形状或其它机械支撑来防止焊盘超超,surfaceComponentsrequiredtobemountedabovetheboardare1.essthan1.511mC.059in.要求离开鼓路板外表安装的组件与线路板的距离小于1.5mm(0.059in)Figure图5-145. 2.3Mounting-Horizonta1-Radia11.eaded安装一一水平一一径向引脚Target-C1.ass1.2,3目标一一等级1,2,3Thecomponentbodyisinf1.atcontactwiththeboard'ssurface.组件本体与线路板外表平贴接触,Bondingmateria1.ispresent,ifrequired.See4.4.若箔要,则可存在粕贴的物质，见4.4Figure图5-15Acceptab1.o-C1.ass1.2,3可接受的一一等级1,2,3,Componentincontactwithboardonat1.eastonesideand/orsurface.组件与浅路板至少有一边和/或面接触。Note：Whendocumentedonanapprovedassemb1.ydrawing,acomponentmaybeeithersidemountedorendmounted.Thesideorsurfaceofthebody,orat1.eastonepointofanyirregu1.ar1.yconfiguredcomponent(suchascertainpocketbookcapacitors),needsFigure图5T61.obeinfu1.1.contactwiththeprintedbo
